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Key developments:

• Microsoft unveiled its third‑generation in‑house AI accelerator, the Maia 300, built on TSMC’s N2P process. The chip uses eight HBM4 stacks to deliver 288 GB of memory

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A wave of new AI hardware is reshaping factory floors and supply‑chain engineering. Microsoft’s third‑generation Maia 300 inference chip, built on TSMC’s N2P process, bundles eight HBM4 stacks delivering …

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Key developments:

• Deutz announced plans to triple revenue from its energy unit, citing strong AI‑driven demand for smarter, more efficient industrial engines.
• CloudNC secured $20 million to broaden its

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