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Key developments:
- TSMC’s most advanced CoWoS packaging lines are fully booked through 2027, with lead times now ranging from 52 to 78 weeks, and Nvidia monopolises roughly
Advanced‑Packaging Bottleneck Deepens as AI Chip Demand Outpaces Supply
AI‑Chip Supply Chains Face 2027‑Long Queues as TSMC Packaging Slots Remain Full
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Key developments: TSMC’s most advanced CoWoS packaging lines are fully booked through 2027, with lead times of 52‑78 weeks, and Nvidia consumes 60‑70% of that capacity. Nvidia’s …
Global Chip Supply Chains Tighten as Taiwan Packaging Queues, Korean Memory Constraints, and Chinese Material Controls Converge
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Key developments: TSMC’s most advanced CoWoS packaging lines are fully booked through 2027 with 52‑78‑week lead times, and Nvidia now consumes 60‑70% of that capacity, creating multi‑year queues for AI …