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Key developments this week show the semiconductor industry tightening around AI workloads. TSMC and GlobalFoundries sealed a $2 billion pact to produce silicon interposers for TSMC’s CoWoS advanced‑packaging platform, with volume …
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Key developments: TSMC and GlobalFoundries have sealed a $2 billion pact to produce silicon interposers for TSMC’s CoWoS advanced‑packaging platform, with volume output slated for early 2028. The agreement expands the …
Key developments:
Key developments: Samsung affiliates are committing a combined 12.26 trillion won (about $9.15 billion) to boost semiconductor capacity, with almost $6 billion directed toward new facilities in Vietnam and additional investment to expand high‑end production in South Korea. At the …
