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India has demonstrated a breakthrough in quantum cryptography by successfully transmitting quantum‑encrypted keys across a 5.56 km free‑space optical link, marking the first “un‑cable” quantum key distribution …

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India has demonstrated a breakthrough in quantum cryptography by successfully transmitting quantum‑encrypted keys across a 5.56 km free‑space optical link, marking the first “un‑cable” quantum key distribution …

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India has sent quantum encryption keys across 5.56 km of open air without fibre‑optic cables, using quantum key distribution (QKD) to share a secret cryptographic key via …
Cisco unveiled a research‑grade Quantum Network Controller that adds a control‑plane layer to distributed quantum systems, allowing applications to request entanglement without needing to manage hardware details. The controller abstracts sources, switches, detectors and timing modules behind a hardware abstraction …
A new control plane for quantum networks is emerging from Cisco. Its research‑grade Quantum Network Controller abstracts hardware complexities, letting applications request entanglement by specifying endpoints, rate, fidelity and timing without needing to manage the underlying devices. The Controller continuously …

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Universal Quantum’s $100 million Series A round, the largest ever for a UK‑based quantum firm, will fund its global expansion and the commercialization of a modular, fault‑tolerant quantum‑computer architecture. Analysts anticipate the quantum‑technology market …

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Universal Quantum’s $100 million Series A round, the largest ever for a UK‑based quantum firm, will fund the rapid expansion of its modular quantum‑computer architecture and the construction of a new R&D centre in …

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Key developments: At the upcoming Pack Expo 2026 in Chicago (Oct 18‑21), leading firms such as Tetra Pak, Shurtape and Greiner Packaging are centering their showcases on technologies that boost …

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The upcoming Pack Expo 2026 in Chicago will spotlight how packaging firms are tackling the twin challenges of boosting production efficiency and cutting material use. Major players such as Tetra …

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Key developments:

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Key developments: TSMC’s most advanced CoWoS packaging lines are fully booked through 2027, with lead times of 52‑78 weeks, and Nvidia consumes 60‑70% of that capacity. Nvidia’s …