Category: AI in manufacturing

Key developments: – Microsoft unveiled its third‑generation in‑house AI accelerator, the Maia 300, built on TSMC’s N2P process. The chip uses eight HBM4 stacks to deliver 288 GB of memory and 18 TB/s bandwidth per accelerator, offering 2.5× the bandwidth of…

A wave of new AI hardware is reshaping factory floors and supply‑chain engineering. Microsoft’s third‑generation Maia 300 inference chip, built on TSMC’s N2P process, bundles eight HBM4 stacks delivering 18 TB/s per accelerator and promises up to seven‑fold higher…

Key developments: – Deutz announced plans to triple revenue from its energy unit, citing strong AI‑driven demand for smarter, more efficient industrial engines. – CloudNC secured $20 million to broaden its AI‑powered precision‑machining platform, giving manufacturers faster, data‑driven toolpath…