Key developments this week show the semiconductor industry tightening around AI workloads. TSMC and GlobalFoundries sealed a $2 billion pact to produce silicon interposers for TSMC’s CoWoS advanced‑packaging platform, with volume expected by early 2028. At the same time,…
Continue reading AI‑driven chip demand fuels a wave of $2B deals, record sales and new memory investmentsKey developments: TSMC and GlobalFoundries have sealed a $2 billion pact to produce silicon interposers for TSMC’s CoWoS advanced‑packaging platform, with volume output slated for early 2028. The agreement expands the U.S. interposer supply chain and underscores the shift…
Continue reading TSMC‑GlobalFoundries $2B Interposer Deal Fuels AI‑Driven Packaging SurgeKey developments: – Samsung’s affiliates announced a $9.15 billion investment plan, with almost $6 billion directed to build new fabs and advanced‑node production in Vietnam and to expand high‑end chip manufacturing in South Korea. The move is aimed at bolstering…
Continue reading Samsung and GlobalFoundries Lead a Wave of Major Investments in Semiconductor Capacity and Advanced Process TechnologyKey developments: Samsung affiliates are committing a combined 12.26 trillion won (about $9.15 billion) to boost semiconductor capacity, with almost $6 billion directed toward new facilities in Vietnam and additional investment to expand high‑end production in South Korea. At the same time, GlobalFoundries…
Continue reading Samsung and GlobalFoundries Drive Major Expansion in Semiconductor Manufacturing
